PCBA Quality Control (QC) Process
Full-process quality control covering PCB incoming inspection, component placement, soldering, testing, and finished product delivery
Quality control for PCBA is essential throughout the entire process, from PCB incoming material inspection, component placement, soldering, testing to finished product delivery. HUASUN’s core objective is to proactively eliminate defects through standardized SOP control. We implement exceptionally stringent standards for the procurement of all supporting components, minimizing potential risks to the greatest extent and ensuring that our products fully meet design specifications and customer requirements.
1、Raw Material Quality Control
| Control Stages | Inspection Items | Inspection Methods | Acceptance Criteria |
|---|---|---|---|
| PCB Board | Appearance defects (scratches, deformation, oxidation), dimensional accuracy, circuit continuity, pad flatness | AOI automatic inspection + manual spot check | Complies with IPC-A-600 standards; no open circuits, short circuits, or pad detachment |
| Component | Model specifications, appearance integrity, pin oxidation, moisture-proof packaging | Barcode scanning verification + visual inspection + performance spot check | Matches BOM list exactly; no damage or oxidation; performance parameters meet specifications |
| Auxiliary Material | Solder paste viscosity, flux composition, adhesive expiration date | Viscosity tester + component analysis | Meets process requirements; within valid expiration period |
2、In-Process Quality Control (IPQC): Full-Process Control
（1）SMT Placement Stage
| Control Nodes | Control Content | Testing Equipment | Control Frequency |
|---|---|---|---|
| Solder Paste Printing | Printing thickness, offset, bridging, missing printing | 3D Solder Paste Inspection (SPI) | First Article Full Inspection; 5 samples inspected every 2 hours |
| Component Placement | Component offset, polarity error, missing placement, reverse mounting | Automated Optical Inspection (AOI) | First Article Full Inspection; 100% inline inspection during mass production |
（2）Soldering Stage
| Control Nodes | Control Content | Testing Equipment | Control Frequency |
|---|---|---|---|
| Reflow Soldering / Wave Soldering | Cold solder joints, false soldering, solder bridging, solder balls, component damage | Automated Optical Inspection (AOI) + Visual Inspection | First Article Full Inspection; 100% inline inspection during mass production |
| Selective Soldering | Local solder joint quality, thermal damage to surrounding components | X-Ray Inspection + Magnifying Glass Spot Check | First Article Full Inspection; 100% inspection for critical components |
（3）Through-Hole Insertion & Assembly Stage
| Control Nodes | Control Content | Inspection Methods | Control Frequency |
|---|---|---|---|
| Special-shaped Component Insertion | Insertion direction, pin length, missing component insertion | Manual Visual Inspection + Automated Optical Inspection (AOI) | First Article Full Inspection; 10% sampling inspection per batch |
| Dispensing & Curing | Adhesive uniformity, curing effect, component fixing strength | Visual Inspection + Pull Force Test | First Article Full Inspection; 3 samples inspected per hour |
3、Final Quality Control (FQC): Pre-Shipment Final Inspection
| Inspection Items | Inspection Content | Testing Equipment | Acceptance Criteria |
|---|---|---|---|
| Final Visual Inspection | Overall appearance, component alignment, solder joint quality, cleanliness | Manual Visual Inspection + Magnifying Glass | No obvious defects; complies with customer appearance requirements |
| Electrical Performance Testing | Circuit continuity, component parameters, short/open circuits | In-Circuit Tester (ICT) | All test points are conductive; parameters within standard ranges |
| Functional Testing | Simulate actual operating environment to verify overall PCBA performance | Functional Circuit Tester (FCT) | All functions operate normally; meets product specifications |
| Reliability Testing | High-temperature aging, vibration testing, humidity testing | Aging Test Chamber, Vibration Test Bench | No performance degradation or faults after testing |
Industry Standard References
Manufacturing Process
Design File Review and DFM Optimization
Material Procurement & IQC
Production Planning and Equipment Commissioning
Solder Paste Printing
Component Placement
Reflow Soldering Reflow
Automated Optical Inspection (AOI)
DIP Insertion and Soldering
In-Circuit Testing (ICT)
Functional Circuit Test (FCT)
Outgoing Quality Control (OQC)
Assembly and Packaging Stage
If you have any quality issues during use, please feel free to contact us via email at sales@hussunpcb.com. We will resolve the problem for you promptly.